Chemical mechanical planarization for Ta-based superconducting quantum devices

Laser Assisted Chemical Mechanical Polishing for Planarization

Yield improvement of chemical mechanical planarization processes

Eamkajornsiri, Sutee, "Yield improvement of chemical mechanical planarization processes " (2005). Retrospective Theses and Dissertations. Paper 3043. The quality of this reproduction is dependent upon the quality of the copy submitted. Broken or indistinct print, colored or poor quality illustrations and photographs, print bleed-through, substandard margins, and improper alignment can adversely...

Damascene Process and Chemical Mechanical Planarization )e

The constant demand to scale down transistors and improve device performance has led to material as well as process changes in the formation of IC interconnect. Traditionally, aluminum has been used to form the IC interconnects. The process involved subtractive etching of blanket aluminum as defined by the patterned photo resist. However, the scaling and performance demands have led to transiti...

Damascene Process and Chemical Mechanical Planarization

Customer Application Brief Electronics Chemical Mechanical Planarization (CMP) Slurry Manufacturing

Introduction The Chemical Mechanical Planarization (CMP) process plays a key role in the manufacture of data storage, video display panels, and semiconductor chips. The process combines the chemical (acidic or basic) effect of the slurry, which contains micro-abrasives with the mechanical effect provided by polishing to reduce the topography on the wafer or rigid disk substrate. The process for...